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EVENTS

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Ruggedization, the ability to make single-board computers (SBCs) and their components more resistant to harsh environments, is one of the concepts that has empowered the move toward open COTS systems. Without the ability to ruggedize commercial products, sectors such as defense and aerospace would have no choice but to have components manufactured specifically for their mission-critical applications. To operate in these, and other harsh environments, commercial products must be made to operate in more extreme temperatures, and they must be made more resistant to shock and vibration.


Levels of Ruggedization
Thales Computers offers four levels of ruggedization: Standard (level “SA”), Extended (level “WA”), Rugged/Convection Cooled (level “RA”), and Rugged/Conduction-Cooled (level “RC”). The environmental specifications are shown below. You will see that each level can accept higher temperatures and higher levels of vibration and shock.

Level SA WA RA RC
Operating Temperature 0 to 55 °C -20 to 65 °C -40 to 75 °C -40 to 85 °C
-Storage °C -40 to 85 -45 to 100 -45 to 100 -45 to 100
Conformal Coating optional standard standard standard
Rel. Humidity 5 cycles of 48 hours: 90% noncondensing 5 cycles of 48 hours: 90% noncondensing 5 cycles of 48 hours: 95% noncondensing 5 cycles of 48 hours: 95% noncondensing
Vibration Sine 20-500 Hz – 2g Peak 20-500 Hz – 2g Peak 19-2000 Hz – 3g Peak 22-2000 Hz – 5g Peak
Vibration – Random VITA 47 - Class V1 VITA 47 – Class V2 VITA 47 – Class V3
Shock 1/2 Sine 20g Peak, 11 ms 1/2 Sine 40g Peak, 20 ms
Gunfire Vibration       1/2 Sing 40g Peak, 6 ms
Altitude -1,640 to 15,000 ft. -1,640 to 33,000 ft. -1,640 to 33,000 ft. -1,640 to 50,000 ft.

The Ruggedizer
One common method of ruggedization is altering the board’s characteristics at the time of manufacture. Using more robust components and stiffer substrates gives a board more resistance to shock and vibration. Additionally, finding ways to force air to cool the board (convection cooling) may offer extended temperature operating ranges as well. But both these options really depart from the COTS concept, delving more into the realm of custom manufacturing. These qualities must be implemented in the design and manufacture of the board.

Thales Computers is able to offer a different approach. Our patented Ruggedizer™ keeps COTS, well, COTS. As an add-on component that is removable for repairs and upgrades, our Ruggedizer™ enables us to truly ruggedize commercial, off-the-shelf products.

The Ruggedizer™ is a milled aluminum heat drain (or heat sink) that is precisely matched to the topography of the board being ruggedized. The Ruggedizer is “seated” on the board’s components using a proprietary compound that is thermally conductive and elastic, increasing the board’s operating temperature range, as well as its resistance to shock and vibration. It fits perfectly into the slot dimensions of the VMEbus architecture, even allowing the fitting of add-on cards.

The Ruggedizer™ offers myriad benefits, including:
• Increased operating temperature range
• Increased resistance to shock
• Increased resistance to vibration
• Removable for inspection, repair and replacement
• Has no impact on VMEbus footprint
• May be used with any standard Thales Computers SBC

For more information, please read our Ruggedizer White Paper, or contact your nearest Thales Computers sales representative.

Download the Ruggedizer White paper (0.4 MB - pdf file)





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